Characteristic

Productivity 12% up compared to our conventional model

4-8wafer handling capability(Manual loading-stud bump area: up to 195mm

Compact transduser, lessen the impact from radiation heatof bonding stage

Various safety measures, Wafer mapping softwaretraceability capability (option)

Eco design with phenomenally low air cosumption

Lowered temperature bonding(Track record: 50 degree C)

Outstanding position repeatability of +3um(3a)

Post-bond-inspection system is available(option

Semi-automatic 8“  wafer Stud Bump Bonder